size board with metalized back and with small clip heatsink (still air) 3 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 7, 2014 IRF8306MPb.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is follo.

The IRF8306MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package.

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